Trinh Van Trung, Pham Hong Tuan, Nguyen Thanh Hop, Nguyen Van Thanh


Thin films were deposited on SUS440 stainless steel samples by arc plasma evaporation at bias voltage range from -10 to -100 V. X-ray diffraction, optical microscopy, field emission scanning electron microscopy, energy dispersive spectroscopy, microhardness test, and electrochemical test were used to investigate the morphology and properties of the thin films. Particularly, the thin films were composed of chromium nitride (CrN, phases of CrN + Cr) and 0.76 mm thick. They were deposited with microdroplets on the samples. The surface hardness of these films reached the highest value of 1492 HV at the bias of -20 V. As the bias voltage increased, the adhesion of the CrN thin films decreased. The excessively high bias voltage of -100 V led to the delamination of the CrN thin films. The electrochemical test demonstrated that the corrosion resistance in the 3% NaCl solution of CrN coating can be improved.


CrN; adhesion, bias voltage; SUS440; hard coating; corrosion resistant

Full Text:



S. K. Tien, J. G. Duh: Thin Solid Films, Vol. 494, 2006, No. 1-2, p. 173-178, http://dx.doi.org/10.1016/j.tsf.2005.08.198

P. H. Mayrhofer, G. Tischler, C. Mitterer: Surface & Coatings Technology, Vol. 142-144, 2001, p. 78-84, http://dx.doi.org/10.1016/S0257-8972(01)01090-8

C. He´au, R. Y. Fillit, F. Vaux, F. Pascaretti: Surface & Coatings Technology, Vol. 120-121, 1999, p. 200-205, http://dx.doi.org/10.1016/S0042-207X(02)00146-X

S. Y. Lee, B. S. Kim, S. D. Kim, G. S. Kim, Y. S. Hong: Thin Solid Films, Vol. 506-507, 2006, p. 192-196, http://dx.doi.org/10.1016/j.tsf.2005.08.027

Y. P. Purandare, A. P. Ehiasarian, Eh. P. Hovsepian: Journal of Vacuum Science & Technology A, Vol. 26, 2008, No. 2, p. 288-296, http://dx.doi.org/10.1116/1.2839855

T. Suzuki, H. Saito, M. Hirai, H. Suematsu, W. Jiang, K. Yatsui: Thin Solid Films, Vol. 407, 2002, No. 1-2, p. 118-121, http://dx.doi.org/10.1016/S0040-6090(02)00023-8

M. Zhang, M. K. Li, K. H. Kim, F. Pan: Applied Surface Science, Vol. 255, 2009, No. 22, p. 9200-9205, http://dx.doi.org/10.1016/j.apsusc.2009.07.002

M. Holzherr, M. Falz, T. Schmidt: Surface & Coatings Technology, Vol. 203, 2008, No. 5-7, p. 505-509, http://dx.doi.org/10.1016/j.surfcoat.2008.05.054

V. M. Vishnyakov et al.: Thin Solid Films, Vol. 497, 2006, No. 1-2, p. 189-195, http://dx.doi.org/10.1016/j.tsf.2005.05.005

T. Bin, Z. Xiaodong, H. Naisai, H. Jiawen: Surface & Coatings Technology, Vol. 131, 2000, No. 1-3, p. 391-394, http://dx.doi.org/10.1016/S0257-8972(00)00769-6

X. S. Wan, S. S. Zhao, Y. Yang, J. Gong, C. Sun: Surface & Coatings Technology, Vol. 204, 2010, No. 11, p. 1800-1810, http://dx.doi.org/10.1016/j.surfcoat.2009.11.021

Z. K. Chang, X. S. Wan, Z. L. Pei, J. Gong, C. Sun: Surface & Coatings Technology, Vol. 205, 2011, No. 19, p. 4690-4696, http://dx.doi.org/10.1016/j.surfcoat.2011.04.037

D. Wang, T. Oki: Thin Solid Films, Vol. 185, 1990, No. 2, p. 219-230, http://dx.doi.org/10.1016/0040-6090(90)90086-S

N. Vidakis, A. Antoniadis, N. Bilalis: Journal of Materials Processing Technology, Vol. 143-144, 2003, p. 481-485, http://dx.doi.org/10.1016/S0924-0136(03)00300-5

H. Ljungcrantz, L. Hultman, J. E. Sundgren, G. Hakansson, L. Karlsson: Surface & Coatings Technology, Vol. 63, 1994, p. 123-128, http://dx.doi.org/10.1016/S0257-8972(05)80016-7

C. Rebholz, H. Ziegele, A. Leyland, A. Matthews: Surface & Coatings Technology, Vol. 115, 1999, No. 2-3, p. 222-229, http://dx.doi.org/10.1016/S0257-8972(99)00240-6

R. O. E. Vijgen, J. H. Dautzenberg: Thin Solid Films, Vol. 270, 1995, No. 1-2, p. 264-269, http://dx.doi.org/10.1016/0040-6090(95)06984-4

DOI: http://dx.doi.org/10.12776/ams.v25i4.1356


  • There are currently no refbacks.

SJR 2014: 0.502 - Q2 Metals and Alloys, 39./125.

SJR 2013: 0.309 - Q2 Metals and Alloys, 59./121.       

SJR 2012: 0.325 - Q2 Metals and Alloys, 33./90. (A)

SJR 2011: 0.363 - Q2 Metals and Alloys, 29./90. (A)

SJR 2010: 0.151 - Q3 Metals and Alloys, 68./90. (B)

SJR 2009: 0 - Q4 Metals and Alloys, 89./90. (C - according to the Slovak Journal Quality Criteria)

Indexed in: SCOPUS, Web of Science Core Collection, CROSSREF, GOOGLE SCHOLAR,CAMBRIDGE SCIENTIFIC ABSTRACTS, Committee on Publication Ethics (COPE)

IČO 00 397 610

EV 5174/15

p-ISSN 1335-1532, e-ISSN 1338-1156